St Morita Dicing Tape with PVC backing and adhesive rubber, used during the wafer dicing process, cutting of semiconductor material followed by microfabrication "wafer". This tape has a relatively low adhesion, no residual transfer and the ability to stretch the good without tearing the material.
Product Category | : | Dicing Tape |
Product Name | : | Dicing Tape PVC Clear - Rubber |
Adhesive Type | : | rubber |
Adhesive Strength | : | 20-30 gF/inch |
Thickness | : | 50 mic |
Tensiles | : | 10-20 N/mm2 |
Elongations | : | 500-600% |
Application of tapes | : | Cover, Holding, Backing |