Dicing Tape PO Clear - Acrylic
Dicing Tape PO Clear - Acrylic

St Morita Dicing Tape with clear polyolefine film backing and adhesive acrylic, used during the wafer dicing process, cutting of semiconductor material followed by microfabrication "wafer". This tape has a relatively low adhesion, no residual transfer and the ability to stretch the good without tearing the material.

Product Category : Dicing Tape
Product Name : Dicing Tape PO Clear - Acrylic
Adhesive Type : acrylic
Adhesive Strength : 20-30 gF/inch
Thickness : 70 mic
Tensiles : 10-20 N/mm2
Elongations : 200-250%
Application of tapes : Cover, Holding, Backing